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Certicom to Optimize Security for Texas Instruments OMAP Platform

Monday 14 March 2005 10:50 CET | News

Certicom, has announced a Board Support Package, Security Builder BSP for Texas Instruments Incorporateds (TIs) OMAP platform. This collaboration enables device manufacturers to quickly and cost-effectively embed security across multiple families and generations of devices.

Certicom will support TIs OMAP2420 processors through an optimized hardware abstraction layer to allow cryptographic acceleration of symmetric and public key algorithms and key storage. This functionality is part of the overall Certicom Security Architecture, a comprehensive solution that makes it easier for mobile handset developers and device manufacturers to realize the benefits of hardware-optimized security. This work is an extension of the existing relationship that began in 2002. In September 2004, Certicom launched the Certicom Security Architecture, a modular set of security services, software cryptographic providers (including a FIPS 140-2 Validated cryptographic module), and board support packages that bind applications to any hardware cryptographic provider that may be available. All components of the Architecture are unified by a common, intuitive application programming interface (API) between the applications, services and the cryptographic providers. The API accesses the fastest and/or strongest security available on the device, and enables developers to quickly migrate their applications to whichever cryptographic module is required. Certicom is a member of TIs OMAP Developer Network, a group of leading software developers porting advanced applications to TIs high performance, power-efficient OMAP processors. Handset manufacturers adopting OMAP devices enjoy the rapid deployment of compelling wireless applications - including streaming audio and video, multimedia messaging, gaming, security, speech recognition, location based services and mobile commerce - across all leading operating systems. Systems level integration services are also provided worldwide by independent OMAP Technology Centers. The OMAP platform has been selected by leading manufacturers, such as Nokia, Palm, NEC, Fujitsu, LG Electronics, Hewlett-Packard, Sendo, HTC and many more, for their 2.5 and 3G wireless devices. For more information, please visit www.ti.com/omap.


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