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Mitec Introduces Groundbreaking RF Technology

Friday 30 April 2004 10:50 CET | News

Mitec Telecom has developed a groundbreaking RF technology that delivers significantly improved price performance for RF front ends used in wireless networks.

The technologys innovative heat flow management architecture makes it possible to produce high-power RF components from materials such as advanced polymer composites and plastics, rather than traditional metal alloys and precious metals. This approach reduces component weight and drastically improves the efficacy of the manufacturing process. Another central advantage of the new technology is that it can be used in the architectural frameworks of existing basestation products. The leading-edge technology was developed by Mitecs global R&D team, and patents are currently pending.


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Categories: Payments & Commerce | Mobile Payments
Countries: World
This article is part of category

Payments & Commerce