Soldo closes USD 180 mln Series C funding round

Wednesday 21 July 2021 10:54 CET | News

Europe-based pay and spend automation platform Soldo has closed a USD 180 million oversubscribed Series C funding round. 

The fundraise was led by Temasek, a Singapore-based global investor. The round includes new investors Sunley House Capital, Advent International’s crossover fund, Citi Ventures and continued backing from Accel, Battery Ventures, Dawn Capital, and Silicon Valley Bank for debt financing. Goldman Sachs acted as the exclusive placement agent to Soldo for the deal. 

Soldo’s pay and spend automation platform gives businesses real-time visibility and cost control across all departments. The funding round means Soldo can continue to accelerate product development and market expansion across Europe’s addressable market of USD 170 billion.  

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Keywords: spend management, investment
Categories: Banking & Fintech | E-invoicing, SCF & E-procurement
Countries: Europe
This article is part of category

Banking & Fintech